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AMD has said that they're aiming for a 16-nanometer-thick die

Dec. 31, 2017 by Devin Jones

AMD has said that they're aiming for a 16-nanometer-thick die for the Xeon Scalable Processors (SP) for its AP and Core i7 processors, and also plans to have a new 16-nanometer-thick die for the Core i7-series and Core i7-series processors.

The processors will also be equipped with more PCIe x16 lanes, with the most recent AMD-developed PCIe x8, as well as the latest Intel-developed Xeon Scalable Processors (SP) and Scalable Processors (SPs). Intel already has Xeon SP processors, with a Xeon SP-2 series socket.

The processors will include a number of PCIe lanes, with 16 lanes available for use with the Xeon Scalable Processors (SPs) and Scalable Processors (SPs), with the most recent Intel-developed PCIe x8, as well as the latest Intel-developed Xeon Scalable Processors (SPs). The Xeon SP-1 series and the Xeon SP-2 series processors will use Intel-designed PCIe x16 lanes.

The Xeon SP-3 series processors will use Intel-designed PCIe x16 lanes.

Intel plans to release a new chip for the Xeon Phi series, the first high-end Core processors to use two PCIe connectors, as well as two PCIe x16 lanes.

The AP/Core line offers better performance for both desktop and mobile workloads, as well as a low-power memory controller. The Core i7-series, which is also running both a Xeon i7-6770 and Core i7-6790 motherboards, boasts a higher performance core, but with fewer die space, while the Core i7-6600 motherboards have a more powerful processor.